Metal masks used in SMT and PCB manufacturing require "thick film" specifications for solder printing and via filling.
At SERIA, we utilize various processing techniques such as laser machining, plating, and etching to choice the optimal specifications for each application.
We can also accommodate highly precise processes such as solder ball placement on wafers and mounting of ultra-small electronic components.
By supplying high-quality and stable metal masks, we contribute to improved reliability in electronic component manufacturing.
Solder Printing Mask
In the field of metal masks for electronic component mounting, SERIA combines plate-making and metal processing technologies, boasting a strong track record.
For mainstream laser masks, our proprietary secondary processing technology enhances solder release, earning high praise for our "ULTIMA" model.
By providing high-precision and high-performance masks, we support both quality and efficiency in the mounting process.
Standard Model
ULTIMA
Quick-Set Frame
A high-performance metal mask frame that allows one-touch attachment and detachment of the mask section.
Its implementation offers various benefits, including streamlined setup changes, reduced mask storage space, and cost savings.
With a simple design for easy handling, it comes in a wide range of frame sizes compatible with mounting machines, flexibly meeting on-site needs.
01Preset
02Set
03Finish