We support inter-process integration & the realization of dedicated machines, with extensive experience in “FA solutions”We propose automation & labor-saving equipment to reduce workload & improve efficiency.
Gravure offset printing realizes the Micro-Ball mounting technology for semiconductor chips. It achieves high-precision printing that surpasses the limitations of traditional screen printing using metal masks.
Gravure offset printing machines specialized in fine line printing enable process shortening & cost reduction.
To meet the needs for advanced & flexible IoT devices, we propose FHE (Flexible Hybrid Electronics), which integrates semiconductor & printing technologies.
To address the challenges of micro LED mounting, we propose terminal formation using gravure offset printing technology. Fine & precise solder printing enables component mounting with advantages in cost & performance.
For companies concerned about plate procurement or considering cost reduction & environmental impact mitigation, SERIA offers solutions through direct plate-making.
Copper is relatively inexpensive & has fewer resource constraints. It is expected to see extended applications in renewable energy devices, next-generation displays, a semiconductor mounting fields.