IoT Device Solution

FHE (Flexible Hybrid Electronics)

The importance of IoT devices is increasing year by year. As they are required to conform to curved surfaces or be worn on the skin, the demand for flexibility is growing. Our proposed technology is FHE (Flexible Hybrid Electronics). IoT devices require advanced functions such as computation, memory, and communication. It is impossible to manufacture all these functions through printing alone. Therefore, FHE involves mounting ICs and various passive components on inexpensive flexible substrates such as PET. FHE is truly a hybrid technology that combines semiconductor and　printing technologies.

FHE Prototype Example
 (Temperature and　Impact Detection Logistics Sensor)

Fine-pitch wiring printing is possible

Wiring for mounting IC chips requires fine printing. By using our gravure offset printing technology, fine-pitch wiring printing is possible. Additionally, bump printing required for bonding can also be performed using gravure offset printing.