Established technology for mounting Φ30μm Micro-Balls
Semiconductor packaging has evolved from single-chip FC-BGA on one substrate to 2.5D SiP (System in Package) with multiple semiconductor chips mounted on an interposer. Technologies for BGA-Balls (φ150–760μm) and FC-Balls (φ60–90μm) have already been established.Realizing Micro-Balls for mounting semiconductor chips has been a challenge.We have established φ30μm Micro-Ball mounting technology in collaboration with ball mounting equipment manufacturer Athlete FA.
Schematic diagram of semiconductor package (SIP)
System in Package with multiple chips mounted on an interposer
High-precision flux paste printing
By applying fine printing technology using gravure offset, flux paste required for solder ball mounting is printed with high precision.Using gravure offset printing enables printing of φ30μm (pitch 60μm), surpassing the limitations of conventional screen printing with metal masks.
Electrode
Print flux paste
Mount solder balls
High printing position accuracy
One major feature of gravure offset printing is its high printing position accuracy.Unlike screen printing, it does not distort the plate, making it theoretically advantageous. Flux paste can be printed accurately on the electrode.
Screen printing
Gravure offset printing
PEPIO-F12SC
BM-1400W