Gravure Off Set Printing Machine

Product Features: ◆Flagship Model with the Ultimate Printing Technology ◆Meets SEMI standards in addition to the dimensional accuracy, positional accuracy, and mechanical rigidity required for semiconductor manufacturing equipment. ◆In SMT, where demand for micro/high density mounting is increasing, we also propose this technology as a way to achieve fine, narrow-pitch solder printing.

Basic Specifications

Max Work Dimensions (TD×MD※)	370x370mm
Base Material Thickness	0.05~2.0mm
Max Frame Dimensions (TD×MD※)	370x470mm　t5mm
Work Suction Area (TD×MD※)	370x370mm
Vacuum Section Structure	Adsorption hole structure for glass substrates of 370 mm square and two types of wafers (12-inch and 8-inch)
Frame Suction Area (TD×MD※)	370x470mm
Suction Hole Diameter/Pitch	Φ2.0mm/10mm pitch(Mask Plate)
Number of Cameras	4 Cameras
Ink Acceptance/Transfer Speed	2.0~200.00mm/sec
Table Speed During Coating/Scraping	2.0~200.00mm/sec
Blanket Cylinder Reference Diameter	Φ190mm
Supported Blanket Thickness Range	0.50~3.00mm(Including Under Blanket)
Printing Pressure	0.000~1.000mm(Blanket Pushing Amount Setting)
Peripheral Speed Ratio Setting	-0.500~+0.500%(To Substrate/to Mask Plate)
Machine Dimensions (W×D×H)	3383x1911x2047mm
Machine Weight	Approx. 4500kg
Electric Capacity	3-Phase 200V　50/60Hz　19kW
Air Supply Volume	30ℓ/min　0.5MPa

Initiatives for Bonding Material Applications and Redistribution Layers, etc.

Printing Position Accuracy ±5µm

Development of copper paste Formation of Electrical Circuits

For Micro LED Mounting Applications

Enables bonding of Micro LEDs through fine solder paste printing
→ Micro LED Mounting Solution

Solder Printing for High-density Component Mounting