Gravure offset printing machines specialized in fine line printing enable process shortening and cost reduction.
Gravure offset printing realizes the Micro-Ball mounting technology for semiconductor chips. It achieves high-precision printing that surpasses the limitations of traditional screen printing using metal masks.
To address the challenges of micro LED mounting, we propose terminal formation using gravure offset printing technology. Fine and precise solder printing enables component mounting with advantages in cost and performance.
To meet the needs for advanced and flexible IoT devices, we propose FHE (Flexible Hybrid Electronics), which integrates semiconductor and printing technologies.
For companies concerned about plate procurement or considering cost reduction and environmental impact mitigation, SERIA offers solutions through direct plate-making.
We support inter-process integration and the realization of dedicated machines, with extensive experience in FA solutions.We propose automation and labor-saving equipment to reduce workload and improve efficiency.
Copper is relatively inexpensive and has fewer resource constraints. It is expected to see expanded applications in renewable energy devices, next-generation displays, and semiconductor mounting fields.