SERIA CORPORATION
SERIA CORPORATION



Micro LED Mounting Solution



Micro LEDs are expected to be the mainstay of next-generation displays. It is said that the challenge is mounting. We have made it possible to print fine solder paste using gravure offset printing technology. By taking advantage of the fineness and high precision that are the characteristics of gravure offset printing, we can print solder paste accurately on the TFT substrate. With a resolution of φ10μm or less, which is an area that is impossible with conventional screen offset, we have achieved a positional accuracy of ±5μm or less over the entire surface of a 300mm square substrate. Compared to the commonly used ACF, it has advantages in terms of cost, resistance value, pressure, and reflow temperature.
TFT Backplane
Print solder paste on the contact area using gravure offset
Mounting micro LED Elements
Printing result on glass substrate
Reflow (Formic Acid) on Cu Substrate
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