Semiconductor Packaging Solutions

Semiconductor packages have evolved from single-chip FC-BGA, which mounts one chip on one substrate, to 2.5D SIP (System in Package), which mounts multiple semiconductor chips on an interposer. The technology for BGA-Ball (φ150-760μm) and FC-Ball (φ60-90μm) has been established for some time. The challenge now is to realize Micro-Balls for mounting semiconductor chips.
In collaboration with Athlete FA Corporation, a ball mounting machine manufacturer, we have established Micro-Ball mounting technology with a diameter of φ30μm.

Schematic Diagram of Semiconductor Package (SIP)

System in Package: Mounting multiple chips on an interposer

By applying fine printing technology using gravure offset, we print the flux paste required for mounting solder balls with a high degree of precision. Gravure offset printing makes it possible to print at a diameter of 30 μm (pitch 60 μm), exceeding the limits of conventional screen printing using metal masks.

One of the major features of gravure offset printing is its excellent printing position accuracy. In principle, it is advantageous because it does not distort the screen mask as in screen printing. Flux paste can be printed accurately on the electrodes.

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